Microelectronics and Systems Congress | Lübeck | October 25-27, 2027
This was the Congress 2025!
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Progress for Humanity

Technologies for Sustainability, Health and Quality of Life

When Does Innovation Become Progress for Humanity?

Innovation describes the ability to create something new. Progress answers the more important question: What is that new development for?

Few terms are used as frequently today as innovation. In politics, business, and research, it is often regarded as a value in itself. Yet novelty alone is not enough. Even usefulness by itself is not a sufficient criterion for progress. Technologies may become more efficient, faster, or more powerful without automatically contributing to a better future.

Progress begins where technological developments help address the major challenges of our time. The key question, therefore, is not what is technically possible, but what benefit an innovation creates for people and society.

This guiding principle lies at the heart of the Microelectronics and Systems Congress 2027. Sustainability, health, and quality of life are not merely application areas for modern technology. They are the benchmarks against which progress must ultimately be measured. Science and technology realize their true value only when they help improve people's living conditions and promote responsibility toward future generations.

Microelectronics and Microsystems Engineering: Driving Today's Progress

Microelectronics and microsystems engineering are among the defining enabling technologies of our time. They provide the foundation for many of the developments that currently shape public attention, from digitalization and the energy transition to artificial intelligence and quantum technologies. Yet even the most spectacular applications do not emerge in isolation. They are built upon decades of research and development in microelectronics, sensor technologies, system integration, and advanced manufacturing.

Technological progress does not depend solely on research institutions, companies, or funding programs. Equally important are the people who develop these technologies. Against the backdrop of a growing demand for highly skilled professionals, education and talent development within our field have become key challenges for the future.

In the tradition of the MikroSystemTechnik Kongress, we view this congress as a platform for academia, industry, and emerging talent. Under its new name, the Microelectronics and Systems Congress 2027 embraces new topics, perspectives, and partners while remaining firmly rooted in its heritage. We look forward to welcoming both long-standing companions and new members of our community.

An Invitation to Lübeck

We are delighted to welcome you to the Microelectronics and Systems Congress 2027 in Lübeck. Located in the heart of Northern Germany, Lübeck is part of a region that combines technological excellence with an exceptional quality of life. Hamburg and Schleswig-Holstein are home to innovations in healthcare, energy technologies, and sustainable development, while offering a living environment that has made Northern Germany one of the most attractive regions to live and work in.

We look forward to sharing inspiring days of exchange and collaboration with you in the Hanseatic city of Lübeck, bringing together scientific discussion and personal interaction while enjoying the maritime spirit and open horizons of Northern Germany. Between tradition and future, between Hanseatic composure and technological dynamism, the region provides an exceptional setting for new ideas, new partnerships, and many stimulating conversations.


Prof. Fabian Lofink and Prof. Hoc Khiem Trieu
Conference Chairs 2027

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© Christian-Albrechts-Universität zu Kiel / André Wirsig

Prof. Fabian Lofink and Prof. Hoc Khiem Trieu
Conference Chairs 2027

Topics

Conference Topics

Topics

Conference Topics

1 Chip Design, EDA & Compute Hardware
•    ASIC/SoC
•    Analog/Mixed-Signal/RF-Design
•    HW-SW-Co-Design
•    EDA
•    Open-Source-Designflows
•    PDKs
•    AI-powered Design
•    Design for Test/Security/Reliability
•    AI-Accelerator
•    Neuromorphic Architectures
•    Edge AI
•    In-/Near-Memory-Computing
•    Special Processors
•    Computing Units for Robotics

2 Materials, Processes & Manufacturing (Lab to Fab)
•    New Materials from 0D bis 3D
•    Building Component Concepts
•    Process Technologies
•    Modelling and Simulation
•    Equipment and Intermediate Products
•    Prototyping
•    Pilot Lines
•    Process Qualification
•    Design-to-Manufacturing
•    Industrial-scale Production
•    Foundry- und Infrastructure Access

3 Advanced Packaging & Heterogeneous Integration
•    Chiplets
•    2.5D/3D-Integration
•    Integration Technologies
•    Packaging-Technologies
•    Interposer
•    Wafer-Level Packaging
•    Co-Packaged Optics
•    Thermal Management
•    Packaging for High-Performance Computing Systems

4 Sensors, Actuators & Intelligent Microsystems
•    MEMS/NEMS
•    Micro Sensors
•    Micro Actuators
•    Sensor Fusion
•    Micro Fluidic
•    Structural Health Monitoring
•    Microsystems for Robotics

5 Power & RF Electronics
•    Power Electronics
•    Power ICs
•    RF/mmWave/THz
•    Communications Electronics
•    Energy Harvesting
•    Power Management

6 Photonics & Quantum Technologies
•    Integrated Photonic Circuits
•    Optical Interconnects
•    Quantum Technology Components
•    Cryogenic, Control, and Readout Electronics
•    Packaging and Integration for Qubit-Systems

7 Security, Reliability & Sustainability
•    Hardware Security
•    Trusted Electronics
•    Security-by-Design
•    Reliability
•    Test Metrology
•    Functional Safety
•    Green ICT
•    Resource Efficiency
•    Circular Economy

Committee

Steering Committee

Committee

Chairmen 2027

  • Prof. Hoc Khiem Trieu, Technische Universität Hamburg
  • Prof.  Fabian Lofink, Fraunhofer ISIT, Itzehoe

Members of the Steering Committee

  • Prof. Jens Anders, Universität Stuttgart, Institut für Intelligente Sensorik und Theoretische Elektrotechnik
  • Dr. Simon Armbruster, Robert Bosch GmbH, Reutlingen
  • Prof. Robert Blick, Universität Hamburg
  • Prof. Karl-Heinz Bock, Technische Universität Dresden
  • Frank Bösenberg, Silicon Saxony e.V., Dresden
  • Dr. Sabine Brock, Deutsches Elektronen-Synchrotron (DESY), Hamburg
  • Prof. Thomas P. Burg, Technische Universität Darmstadt
  • Prof. Alfons Dehé, Hahn-Schickard-Gesellschaft für angewandte Forschung e.V. , Villingen-Schwenningen
  • Prof. Andreas Dietzel, Technische Universität Braunschweig, Institut für Mikrotechnik
  • Livio Fornasiero, Dräger Medical Deutschland GmbH
  • Dr. Karl-Peter Fritz, Hahn-Schickard, Stuttgart
  • Prof. Anton Grabmaier, Fraunhofer-Institut für Mikroelektronische Schaltungen und Systeme IMS, Duisburg
  • Dr. Tim Gutheit, Infineon Technologies AG, Neubiberg
  • Philipp Gutmann, AMA Verband für Sensorik und Messetechnik e.V., Berlin
  • Michael Gutowski, microTEC Südwest e.V., Freiburg
  • Dr. Sönke Habenicht, Nxperia Germany, Hamburg
  • Prof. Amelie Hagelauer, Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT, München
  • Prof. Michael Heuken, Aixtron SE, Herzogenrath
  • Prof. Martin Hoffmann, Ruhr-Universität Bochum
  • Prof. Sven Ingebrandt, RWTH Aachen University
  • Christoph Kober, Gesellschaft für Technologieförderung mbH, IZET Innovationszentrum Itzehoe
  • Prof. Jan Korvink, Karlsruher Institut für Technologie KIT
  • Dr. Florian Krogmann, Innovative Sensor Technology IST AG, Ebnat-Kappel
  • Alois Krtil, Artificial Intelligence Center Hamburg (ARIC) e.V., Hamburg
  • Prof. Harald Kuhn, Fraunhofer-Institut für Elektronische Nanosysteme ENAS, Chemnitz
  • Prof. Christoph Kutter, Fraunhofer-Einrichtung für Mikrosysteme und Festkörper- Technologien EMFT, München
  • Prof. Max Lemme, RWTH Aachen
  • Dr. Stephan Marauska, Vishay Siliconix Itzehoe
  • Prof. Jan Mehner, Technische Universität Chemnitz
  • Tim Merforth, IVAM Microtechnology Network, Dortmund
  • Prof. Thomas Mikolajick, Technische Universität Dresden, Namlab
  • Moridi Mohssen, Silicon Austria Labs GmbH, Graz
  • Dr. Ole Mühlfeld, Danfoss Silicon Power GmbH, Flensburg
  • Prof. Jens Müller, Technische Universität Ilmenau
  • Dr. Volker Nestle, Festo SE & Co. KG, Esslingen
  • Dr. Christine Neuy, microTec Südwest e.V., Freiburg
  • Dr. Axel Preusse, GlobalFoundries Dresden
  • Prof. Niels Quack, IMS Chips, Stuttgart
  • Prof. Harald Schenk, Fraunhofer-Institut für Photonische Mikrosysteme IPMS, Dresden
  • Prof. Ulrich Schmid, Technische Universität Wien, Institut für Sensor und Aktuatorsysteme
  • Dr. Ronald Schnabel, VDE/VDI-Gesellschaft Mikroelektronik Mikrosystem- und Feinwerktechnik, Offenbach am Main
  • Dr. Matthias Seydack, VDI/VDE Innovation + Technik GmbH, Berlin
  • Dr. Eike-Christian Spitzner, VDI/VDE Innovation + Technik GmbH, Dresden
  • Eric Starke, SICK Engineering GmbH, Ottendorf-Okrilla
  • Dr. Gerd Teepe, Celtro GmbH, Dresden
  • Anh Tuan Tham, Endress+Hauser GmbH+Co.KG, Stahnsdorf
  • Prof. Hoc Khiem Trieu, Technische Universität Hamburg
  • Olaf Vogt, Nxperia Germany, Hamburg
  • Christian Wiebus, nxp Semicounductors Germany, Hamburg
  • Prof. Roland Zengerle, Hahn-Schickard-Gesellschaft für angewandte Forschung e.V. und Albert-Ludwigs-Universität Freiburg
  • Prof. André Zimmermann, Hahn-Schickard-Gesellschaft für angewandte Forschung e.V. , Stuttgart
Committee

Program Committee

Committee

Chairmen 2027

  • Prof. Hoc Khiem Trieu, Technische Universität Hamburg
  • Prof. Fabian Lofink, Fraunhofer ISIT, Itzehoe

Members of the Program Committee 

  • Prof. Rainer Adelung, Christian-Albrechts-Universität zu Kiel
  • Prof. Oliver Amft, Albert-Ludwigs-Universität Freiburg
  • Dr. Karin Bauer, Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT, München
  • Prof. Thomas P. Burg, Technische Universität Darmstadt
  • Prof. Alfons Dehé, Hahn-Schickard-Gesellschaft für angewandte Forschung e.V., Villingen-Schwenningen
  • Prof. Andreas Dietzel, Technische Universität Braunschweig, Institut für Mikrotechnik
  • Prof. Inga Anita Fischer, Brandenburg Technical University, Cottbus-Senftenberg
  • Prof. Andreas Foitzik, Technische Fachhochschule Wildau
  • Prof. Anton Grabmaier, Fraunhofer-Institut für Mikroelektronische Schaltungen und Systeme IMS, Duisburg
  • Prof. Shanshan Gu-Stoppel, Fachhochschule Westküste, Heide
  • Prof. Karla Hiller, Technische Universität Chemnitz 
  • Prof. Martin Hoffmann, Ruhr-Universität Bochum
  • Prof. Dennis Hohlfeld, Universität Rostock
  • Prof. Sven Ingebrandt, RWTH Aachen University
  • Prof. Robert Kirchner, Technische Universität Dresden
  • Prof. Roy Knechtel, Hochschule Schmalkalden
  • Prof. Manfred Kohl, Karlsruher Institut für Technologie KIT
  • Prof. Christoph Kutter, Fraunhofer-Einrichtung für Mikrosysteme und Festkörper- Technologien EMFT, München
  • Dr. Christina Leinenbach, Robert Bosch GmbH, Gerlingen
  • Dr. Steffen Leopold, X-Fab Semiconductor Foundries AG, Erfurt
  • Prof. Erica Lilleodden, Fraunhofer-Institut für Siliziumtechnologie ISIT, Itzehoe
  • Timo Lipka, Technische Universität Hamburg-Harburg
  • Prof. Björn Lüssem, Universität Bremen, Institut IMSAS
  • Prof. Hagen Malberg, Technische Universität Dresden
  • Prof. Uwe Marschner, TU Dresden
  • Prof. Jan Mehner,  Technische Universität Chemnitz
  • Prof. Ulrich M. Mescheder,  Fachhochschule Furtwangen, Institut für Angewandte Forschung IAF
  • Dr. Claas Müller, Albert-Ludwigs-Universität Freiburg - Institut für Mikrosystemtechnik IMTEK
  • Prof. Jens Müller, Technische Universität Ilmenau
  • Prof. Oliver Paul, Albert-Ludwigs-Universität Freiburg, Institut für Mikrosystemtechnik IMTEK
  • Prof. Nils Pohl, Ruhr-Universität Bochum
  • Prof. Niels Quack, IMS Chips, Stuttgart
  • Dr. Martin Richter, Fraunhofer Einrichtung für Mikrosysteme und Festkörper -Technologien EMFT, München
  • Prof. Volker Saile, Volker, Karlsruher Institut für Technologie 
  • Prof. Olivier Schecker, Hochschule Karlsruhe - Technik und Wirtschaft - University of Applied Sciences, Karlsruhe
  • Prof. Harald Schenk, Fraunhofer-Institut für Photonische Mikrosysteme IPMS, Dresden
  • Prof. Ulrich Schmid, Technische Universität Wien, Institut für Sensor und Aktuatorsysteme
  • Prof. Gabriele Schrag, Technische Universität München
  • Prof. Jörg Schulze, Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB, Erlangen
  • Prof. Andreas Schütze, Universität des Saarlandes, Saarbrücken
  • Prof. Stefan Sinzinger, Technische Universität Ilmenau
  • Dr. Fabian Stoppel, Fraunhofer-Institut für Siliziumtechnologie ISIT, Itzehoe
  • Prof. Roland Thewes, Technische Universität Berlin
  • Prof. Hoc Khiem Trieu, Technische Universität Hamburg
  • Prof. Michael Vellekoop, Universität Bremen
  • Dr. Thomas Velten, Fraunhofer-Institut für Biomedizinische Technik IBMT, Sulzbach
  • Dr. Uwe Vogel, Fraunhofer-Institut für Photonische Mikrosysteme IPMS, Dresden
  • Prof. Ulrike Wallrabe, Albert-Ludwigs-Universität Freiburg, Institut für Mikrosystemtechnik IMTEK
  • Prof. Peter Woias, Albert-Ludwigs-Universität Freiburg, Institut für Mikrosystemtechnik IMTEK
  • Prof. Roland Zengerle, Hahn-Schickard-Gesellschaft für angewandte Forschung e.V. und Albert-Ludwigs-Universität Freiburg
  • Prof. Martin Ziegler, Christian-Albrechts-Universität zu Kiel

Venue

Musik- und Kongresshalle Lübeck
Willy-Brandt-Allee 10
23554 Lübeck
www.muk.de/

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